Opening book details…
Can I read 2026 3 3 Marinissen on EtoBox?
2026 3 3 Marinissen by Kevin Ren is a document available to read on EtoBox.
What is 2026 3 3 Marinissen about?
The document discusses the transition from traditional micro-bumps to hybrid bonding in 3D-stacked integrated circuits (ICs), emphasizing the benefits of tighter pitch and increased density in interconnects. It outlines the challenges and solutions related to testing for manufacturing defects, including failure modes, fault models, and the impact of bonding techniques on testing. The speaker, Dr. Erik Jan Marinissen, presents insights from his extensive experience in the field and the current state of resea
- Author
- Kevin Ren
- Language
- EN