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3D interconnect architecture for high-bandwidth massively paralleled imager by K. Kwiatkowski; J.C. Lyke; R.J. Wojnarowski; J.-F. Beche; R. Fillion; C. Kapusta; J. Millaud; R. Saia; M.D. Wilke is a scholarly article available to read on EtoBox.

What is 3D interconnect architecture for high-bandwidth massively paralleled imager about?

The proton radiography group at LANL is developing a fast (5 Â 10 6 frames/s or 5 megaframe/s) multi-frame imager for use in dynamic radiographic experiments with high-energy protons. The mega-pixel imager will acquire and process a burst of 32 frames captured at inter-frame time B200 ns. Real time signal processing and storage requirements for entire frames, of rapidly acquired pixels impose severe demands on the space available for the electronics in a standard monolithic approach. As such, a 3D arrangement of detector and circuit elements is under development. In this scheme, the readout integrated circuits (ROICs) are stacked vertically (like playing cards) into a cube configuration. Another die, a fully depleted pixel photo-diode focal plane array (FPA), is bump bonded to one of the edge surfaces formed by the resulting ROIC cube. Recently, an assembly of the proof-of-principle test cube and sensor has been completed.

Author

K. Kwiatkowski; J.C. Lyke; R.J. Wojnarowski; J.-F. Beche; R. Fillion; C. Kapusta; J. Millaud; R. Saia; M.D. Wilke

Publisher

Elsevier Science; Elsevier ; Elsevier BV; ScienceOpen (ISSN 0168-9002)

Published

2003

Language

EN