About this scholarly article

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) - Fracture behaviour of flip chip solder joints by Wiese, S.; Jakschik, S.; Feustel, F.; Meusel, E. is a scholarly article available to read on EtoBox.

Author

Wiese, S.; Jakschik, S.; Feustel, F.; Meusel, E.

Publisher

IEEE

Published

2001