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About this scholarly article
2013 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE) - A study of bonding reliability for substrate to metal cavity of microwave module by Yao, Bin; Lai, Canxiong; Li, Ping; Peng, Zeya is a scholarly article available to read on EtoBox.
- Author
- Yao, Bin; Lai, Canxiong; Li, Ping; Peng, Zeya
- Publisher
- IEEE
- Published
- 2013
- Language
- EN
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