About this scholarly article

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) - New reliability assessment method for solder joints in BGA package by considering the interaction between design factors by Kondo, Satoshi; Yu, Qiang; Shibutani, Tadahiro; Shiratori, Masaki is a scholarly article available to read on EtoBox.

Author

Kondo, Satoshi; Yu, Qiang; Shibutani, Tadahiro; Shiratori, Masaki

Publisher

IEEE

Published

2007