About this scholarly article

2019 International 3D Systems Integration Conference (3DIC) - Process Complexity and Cost Considerations of Multi-Layer Die Stacks by Velenis, Dimitrios; De Vos, Joeri; Kim, Soon-Wook; Derakhshandeh, Jaber J.; Bex, Pieter; Capuz, Giovanni; Suhard, Samuel; Rebibis, Kenneth June; Van Huylenbroeck, Stefaan; Jan Marinissen, Erik; Phommahaxay, Alain; Miller, Andy; Beyer, Gerald; Van der Plas, Geert; Beyne, Eric is a scholarly article available to read on EtoBox.

Author

Velenis, Dimitrios; De Vos, Joeri; Kim, Soon-Wook; Derakhshandeh, Jaber J.; Bex, Pieter; Capuz, Giovanni; Suhard, Samuel; Rebibis, Kenneth June; Van Huylenbroeck, Stefaan; Jan Marinissen, Erik; Phommahaxay, Alain; Miller, Andy; Beyer, Gerald; Van der Plas, Geert; Beyne, Eric

Publisher

IEEE

Published

2019