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What is Diffusion Soldering in Power Electronics about?

This document discusses optimization and evaluation of Cu-Sn based Transient Liquid Phase Soldering (TLPS) as a high-temperature die-attach technique for power electronics. TLPS uses an enriched ŋ-Cu6Sn5 intermetallic phase bondline that was realized successfully with optimized temperature profiles. The quality of the joints was evaluated through thermo-mechanical loading and characterization of thermal and mechanical stability.

Author

MisikEE

Language

EN