About this scholarly article

SPIE Proceedings [SPIE Micromachining and Microfabrication - San Jose, CA (Saturday 24 January 2004)] Reliability, Testing, and Characterization of MEMS/MOEMS III - Wafer-level scale package of MEMS device by eutectic bonding method by Chen, Sihai; Tanner, Danelle M.; Ramesham, Rajeshuni; Ma, Hong; Chen, Mingxiang; Xiong, Tao; Liu, Sheng; Yi, Xinjian is a scholarly article available to read on EtoBox.

Author

Chen, Sihai; Tanner, Danelle M.; Ramesham, Rajeshuni; Ma, Hong; Chen, Mingxiang; Xiong, Tao; Liu, Sheng; Yi, Xinjian

Publisher

SPIE

Published

2004

Language

EN