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Nanolithography Using Thermal Stresses† by Gangadhar Purohit; Deepak; Monica Katiyar is a Materials Science article available to read on EtoBox.

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Nanometer separation (nanogap) in electrodes is a fundamental requirement for several nanoscale devices having applications in nanoelectronics, nanophotonics, biosensing, nanoporous filters, healthcare and medical diagnostics. Most nanolithography techniques, other than extreme/deep ultraviolet lithography are serial processes, such as e-beam lithography, and therefore not scalable. We demonstrate fabrication of nanogaps in Au electrodes over a large area/wafer in parallel processing mode resulting in high throughput. The proposed technique requires tools that are already available in a typical semiconductor device fabrication facility. The concept involves designing a ceramic/metal multilayer structure which is heated to bring the ceramic under tensile stress, and as a result it develops cracks due to low fracture toughness of the ceramic. The feasibility of this idea was established by calculating thermal stresses in different multilayers when heated to a specified temperature level. At practical temperatures, below 500 °C, the developed tensile stresses are higher than the critical stress needed for fracture. Subsequent to separation in the ceramic layer at the desired location,

Who reads Nanolithography Using Thermal Stresses†?

Author

Gangadhar Purohit; Deepak; Monica Katiyar

Publisher

The Royal Society of Chemistry

Published

2018

Language

EN

Field

Materials Science (Physical Sciences)