Opening book details…
Can I read Study of the mechanical properties, toughening and strengthening mechanisms of Si3N4/Si3N4w/TiN nanocomposite ceramic tool materials on EtoBox?
Study of the mechanical properties, toughening and strengthening mechanisms of Si3N4/Si3N4w/TiN nanocomposite ceramic tool materials by Bin Zou; Chuanzhen Huang; Ming Chen; Meilin Gu; Hanlian Liu is a Engineering article available to read on EtoBox.
What is Study of the mechanical properties, toughening and strengthening mechanisms of Si3N4/Si3N4w/TiN nanocomposite ceramic tool materials about?
Si 3 N 4 /Si 3 N 4w /TiN nanocomposites were fabricated by a hot-pressing technology with different sintering processes. The effect of nanoscale TiN and Si 3 N 4w on the mechanical properties was investigated. The microstructure and indention cracks were observed by scanning electron microscopy, transmission electron microscopy and energy-dispersive spectrometry investigations. The research results showed that Si 3 N 4 /Si 3 N 4w 20/TiN5 nanocomposites containing 5 vol.% of nanoscale TiN and 20 vol.% of nanoscale Si 3 N 4w , which were sintered under a pressure of 30 MPa at a temperature of 1650 °C for 40 min, had optimum mechanical properties. The addition of both nanoscale TiN and nanoscale Si 3 N 4w contributed to the microstructural evolution and an improvement of the mechanical properties. The toughening and strengthening mechanisms are discussed for Si 3 N 4 /Si 3 N 4w 20/TiN5 nanocomposites.
Who reads Study of the mechanical properties, toughening and strengthening mechanisms of Si3N4/Si3N4w/TiN nanocomposite ceramic tool materials?
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Bin Zou; Chuanzhen Huang; Ming Chen; Meilin Gu; Hanlian Liu
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 1359-6454)
- Published
- 2007
- Language
- EN
- Field
- Engineering (Physical Sciences)
More by Bin Zou; Chuanzhen Huang; Ming Chen; Meilin Gu; Hanlian Liu
Browse all works by Bin Zou; Chuanzhen Huang; Ming Chen; Meilin Gu; Hanlian Liu