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Multi-Fin Device Thermal Analysis by Anuj Shukla is a document available to read on EtoBox.

This research analyzes self-heating effects in multi-fin finFET devices using thermal modeling and simulation. The researchers develop a distributed thermal model of a single finFET that improves on previous work. They validate the model using finite element analysis software. The model is then extended to account for multiple fins and flared channel geometries. Experiments are conducted to examine thermal profiles and sensitivity based on variations in fin geometry parameters. The goal is to provide guidan

Author

Anuj Shukla

Language

EN