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About this Engineering article

Analysis and Experimental Verification of the Volume Effect in the Reaction Between Zn-Doped Solders and Cu by S.C. Yang; Y.W. Wang; C.C. Chang; C.R. Kao is a Engineering article available to read on EtoBox.

It is typically read by researchers, students, and practitioners in Engineering.

Author
S.C. Yang; Y.W. Wang; C.C. Chang; C.R. Kao
Publisher
Springer US; Springer-Verlag; Springer New York LLC; Springer Science and Business Media LLC (ISSN 0361-5235)
Published
2008
Language
EN
Field
Engineering (Physical Sciences)

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