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Ultra-thermostable embedded liquid cooling in SiC 3D packaging power modules of electric vehicles by Xiaobin Zhang; XiaoLiang Zhao; Wei Li; Zhenyu Wang; Anmou Liao; Yunqian Song; Yun Wang; Lijun Zhang is a Engineering article available to read on EtoBox.

What is Ultra-thermostable embedded liquid cooling in SiC 3D packaging power modules of electric vehicles about?

As the enhanced acceleration performance of electric vehicles demands improved mileage capabilities, 3D packaging is a promising solution for developing high-power-density SiC power modules. However, 3D packaging causes instability owing to the increased heat flux and heat dissipation inside the power module. Thus, this paper proposes an ultra-thermostable embedded liquid cooling strategy for the thermal management of SiC 3D packaging power modules in electric vehicles. We constructed an embedded micro pin–fin (E-MPF) with non-uniform density in the SiC substrate to mount the SiC Schottky barrier diodes (SBDs). The thermostability and temperature uniformity of the SiC 3D packaging power modules containing E-MPF SiC and direct bond copper (DBC) substrates were verified. The results revealed that the SiC SBDs mounted on the E-MPF SiC substrate could stably operate up to a total power dissipation of 320 W at a 100 mL/min coolant (water) flow rate, whereas those attached on the DBC substrate could be operated only under 144 W (operation terminated at a maximum junction temperature of 175 °C). Furthermore, the junction-to-coolant thermal resistance of the E-MPF SiC substrate could be re

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Author

Xiaobin Zhang; XiaoLiang Zhao; Wei Li; Zhenyu Wang; Anmou Liao; Yunqian Song; Yun Wang; Lijun Zhang

Publisher

Elsevier BV

Published

2023

Language

EN

Field

Engineering (Physical Sciences)