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TSV Interconnection in Wafer-on-Wafer MEMS by Pramod Nayak is a document available to read on EtoBox.
What is TSV Interconnection in Wafer-on-Wafer MEMS about?
The document describes a process for stacking thinned silicon wafers on a base wafer using through-silicon vias (TSVs) for interconnection. The key steps are: (1) thinning silicon wafers down to 20um and temporarily bonding to a support glass wafer, (2) stacking the thinned wafers on a base wafer with a benzocyclobutene adhesive layer, (3) patterning TSVs through the stacked wafers and filling with copper for interconnection, (4) stacking up to seven thinned wafers on the base wafer using this process to en
- Author
- Pramod Nayak
- Language
- EN