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A Two-Step Etching Method to Fabricate Nanopores in Silicon by Wang, G. -J.; Chen, W. -Z.; Chang, K. J. is a scholarly article available to read on EtoBox.

What is A Two-Step Etching Method to Fabricate Nanopores in Silicon about?

A cost effectively method to fabricate nanopores in silicon by only using the conventional wet-etching technique is developed in this research. The main concept of the proposed method is a two-step etching process, including a premier double-sided wet etching and a succeeding track-etching. A special fixture is designed to hold the pre-etched silicon wafer inside it such that the track-etching can be effectively carried out. An electrochemical system is employed to detect and record the ion diffusion current once the pre-etched cavities are etched into a through nanopore. Experimental results indicate that the proposed method can cost effectively fabricate nanopores in silicon.

Author

Wang, G. -J.; Chen, W. -Z.; Chang, K. J.

Published

2008

Language

EN