About this scholarly article

17th International Symposium on Design and Diagnostics of Electronic Circuits & Systems - Modeling and analysis of cracked through silicon via (TSV) interconnections by Gerakis, Vasileios; Avdikou, Christina; Liolios, Alexandros; Hatzopoulos, Alkis is a scholarly article available to read on EtoBox.

Author

Gerakis, Vasileios; Avdikou, Christina; Liolios, Alexandros; Hatzopoulos, Alkis

Publisher

IEEE

Published

2014

Language

EN