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Can I read 3D-bioprinted cholangiocarcinoma-on-a-chip model for evaluating drug responses on EtoBox?
3D-bioprinted cholangiocarcinoma-on-a-chip model for evaluating drug responses by Qiong Liu; Luis S. Mille; Cesar Villalobos; Ingrid Anaya; Matthias Vostatek; Sili Yi; Wanlu Li; Junlong Liao; Huanghui Wu; Yongteng Song; Lize Xiong; Yu Shrike Zhang is a Engineering article available to read on EtoBox.
What is 3D-bioprinted cholangiocarcinoma-on-a-chip model for evaluating drug responses about?
Cholangiocarcinoma (CCA) is characterized by heterogeneous mutations and a refractory nature. Thus, the development of a model for effective drug screening is urgently needed. As the established therapeutic testing models for CCA are often ineffective, we fabricated an enabling three-dimensional (3D)-bioprinted CCA-on-a-chip model that to a good extent resembled the multicellular microenvironment and the anatomical microstructure of the hepato-vascular-biliary system to perform high-content antitumor drug screening. Specifically, cholangiocytes, hepatocytes, and vascular endotheliocytes were employed for 3D bioprinting of the models, allowing for a high degree of spatial and tube-like microstructural control. Interestingly, it was possible to observe CCA cells attached to the surfaces of the gelatin methacryloyl (GelMA) hydrogelembedded microchannels and overgrown in a thickening manner, generating bile duct stenosis, which was expected to be analogous to the in vivo configuration. Over 4000 differentially expressed genes were detected in the CCA cells in our 3D coculture model compared to the traditional two-dimensional (2D) monoculture. Further screening revealed that the CCA cel
Who reads 3D-bioprinted cholangiocarcinoma-on-a-chip model for evaluating drug responses?
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Qiong Liu; Luis S. Mille; Cesar Villalobos; Ingrid Anaya; Matthias Vostatek; Sili Yi; Wanlu Li; Junlong Liao; Huanghui Wu; Yongteng Song; Lize Xiong; Yu Shrike Zhang
- Publisher
- Springer Science and Business Media LLC
- Published
- 2023
- Language
- EN
- Field
- Engineering (Physical Sciences)