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What is Wafer Bonding Techniques for Optics about?

The document discusses various wafer bonding techniques for integrated optics, including glass frit bonding which uses a glass particle slurry, anodic bonding which uses high voltage, and molecular wafer bonding. It focuses on adhesive wafer bonding using the material DVS-BCB, outlining the bonding process which involves wafer cleaning, BCB coating and curing, and allows bonding at low temperatures. Examples of fabricated devices including photodetectors and laser diodes integrated on silicon wafers using d

Author

Bianca Băcanu

Language

EN