About this scholarly article

Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307) - Performance and reliability of a cavity down tape BGA package by Schueller, R.D.; Aeschliman, D.; Chiew, T.H. is a scholarly article available to read on EtoBox.

Author

Schueller, R.D.; Aeschliman, D.; Chiew, T.H.

Publisher

IEEE

Published

1997

Language

EN