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About this Engineering article
Acceleration of the growth of Cu3Sn voids in solder joints by Peter Borgesen; Liang Yin; Pericles Kondos is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Peter Borgesen; Liang Yin; Pericles Kondos
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0026-2714)
- Published
- 2012
- Language
- EN
- Field
- Engineering (Physical Sciences)
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