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About this Engineering article
Packaging Approach for Integrating 40/45-nm ELK Devices Into Wire Bond and Flip-Chip Packages by Tan Hua Hong; Beleran, J.; Drake, K.Y.S.; Wilson, O.P.L.; Mehta, G.; Librado, G.; Zhang, X.R.; Surasit, C. is a Engineering article available to read on EtoBox.
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- Author
- Tan Hua Hong; Beleran, J.; Drake, K.Y.S.; Wilson, O.P.L.; Mehta, G.; Librado, G.; Zhang, X.R.; Surasit, C.
- Publisher
- Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers Inc.; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 2156-3950)
- Published
- 2011
- Field
- Engineering (Physical Sciences)