About this scholarly article

2006 International Conference on Electronic Materials and Packaging - Coupled Thermal-Moisture-Stress Analysis for Electronic Packages by Cadge, David; Wang, HJ. Jason; Bie, Junlong; Sun, Xuewei; Bai, Rui; Gong, Ping is a scholarly article available to read on EtoBox.

Author

Cadge, David; Wang, HJ. Jason; Bie, Junlong; Sun, Xuewei; Bai, Rui; Gong, Ping

Publisher

IEEE

Published

2006

Language

EN