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About this Engineering article
Chemical Mechanism of Suppression of Copper Electrodeposition by Poly(ethylene glycol) by Hebert, Kurt R.; Adhikari, Saikat; Houser, Jerrod E. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Hebert, Kurt R.; Adhikari, Saikat; Houser, Jerrod E.
- Publisher
- The Electrochemical Society; Electrochemical Society, Inc. (ISSN 0013-4651)
- Published
- 2005
- Language
- EN
- Field
- Engineering (Physical Sciences)