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About this Engineering article
Reliability Studies of Cu using Wafer Level Joule Heated Electromigration Test by Low, Kia Seng; O'Neill, Anthony is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Low, Kia Seng; O'Neill, Anthony
- Publisher
- Cambridge University Press; Cambridge University Press (Materials Research Society); Cambridge University Press (CUP) (ISSN 0272-9172)
- Published
- 1999
- Field
- Engineering (Physical Sciences)