About this document
10.1007@s10854 016 5586 y by Diện Lê Đắc is a document available to read on EtoBox.
The document discusses the thermophysical properties of Tin-Zinc (Sn-Zn) alloys, which are being explored as lead-free solder alternatives due to their favorable mechanical properties and lower melting points compared to traditional lead-based solders. The study includes measurements of electrical conductivity, thermal conductivity, and viscosity across various temperatures, highlighting the alloys
- Author
- Diện Lê Đắc
- Language
- EN