About this scholarly article

2005 7th Electronic Packaging Technology Conference - Finite Element Analysis on the Thermo-mechanical Behavior of Flip Chip Packages with Au Stud Bump and Non-Conductive Paste by Yeo, A.; Tan Ai Min, ; Pei-Siang, S.L.; Lee, C. is a scholarly article available to read on EtoBox.

Author

Yeo, A.; Tan Ai Min, ; Pei-Siang, S.L.; Lee, C.

Publisher

IEEE

Published

2005

Language

EN