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About this Engineering article
Stress Distribution in 2in SiC Wafer Measured by Photoelastic Method by Sasaki, Makato; Miyanagi, Youichi; Nakayama, Koji; Shiomi, Hiromu; Nishino, Shigehiro is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Sasaki, Makato; Miyanagi, Youichi; Nakayama, Koji; Shiomi, Hiromu; Nishino, Shigehiro
- Publisher
- Trans Tech Publications, Ltd.; Trans Tech Publications Ltd. (ISSN 1662-9752)
- Published
- 2002
- Field
- Engineering (Physical Sciences)