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High rate reactive deposition of TiO2 films using two sputtering sources by Yoichi Hoshi; Daiki Ishihara; Tetsuya Sakai; Osamu Kamiya; Hao Lei is a Engineering article available to read on EtoBox.

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We propose a new high-rate reactive sputter-deposition method with two sputtering sources for fabricating TiO 2 films. One source operates in a metal mode sputtering condition and supplies titanium atoms to the substrate. The other source operates in oxide mode and works as an oxygen radical source for supplying oxygen radicals to the substrate surface for promoting oxidization of titanium atoms. Each sputtering source is separated with a mesh grid from the deposition chamber, and Ar and oxygen gas are introduced separately through the titanium supply and oxygen radical sources, respectively. By using this reactive sputtering system, a deposition rate above 80 nm/min can be obtained for the deposition of TiO 2 films with rutile structure.

Who reads High rate reactive deposition of TiO2 films using two sputtering sources?

Author

Yoichi Hoshi; Daiki Ishihara; Tetsuya Sakai; Osamu Kamiya; Hao Lei

Publisher

Elsevier Science; Elsevier ; Elsevier Ltd.; Elsevier BV (ISSN 0042-207X)

Published

2010

Language

EN

Field

Engineering (Physical Sciences)