About this scholarly article

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) - Development of conductive adhesives filled with low-melting-point alloy fillers by Daoqiang Lu, ; Wong, C.P. is a scholarly article available to read on EtoBox.

Author

Daoqiang Lu, ; Wong, C.P.

Publisher

IMAPS - Int. Microelectron. & Packaging Soc

Published

2000