About this scholarly article

2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems - Applying a physics-based via model for the simulation of Through Silicon Vias by Dahl, David; Duan, Xiaomin; Beyreuther, Anne; Ndip, Ivan; Lang, Klaus-Dieter; Schuster, Christian is a scholarly article available to read on EtoBox.

Author

Dahl, David; Duan, Xiaomin; Beyreuther, Anne; Ndip, Ivan; Lang, Klaus-Dieter; Schuster, Christian

Publisher

IEEE

Published

2013

Language

EN