Skip to content

Opening book details…

About this Engineering article

Thermal Fluid-Structure Interaction in the Effects of Pin-Through-Hole Diameter during Wave Soldering by Aziz, M. S. A.; Abdullah, M. Z.; Khor, C. Y.; Fairuz, Z. M.; Iqbal, A. M.; Mazlan, M.; Rasat, M. S. M. is a Engineering article available to read on EtoBox.

It is typically read by researchers, students, and practitioners in Engineering.

Author
Aziz, M. S. A.; Abdullah, M. Z.; Khor, C. Y.; Fairuz, Z. M.; Iqbal, A. M.; Mazlan, M.; Rasat, M. S. M.
Publisher
SAGE Publications; SAGE Publications Inc.; New York NY: Hindawi Pub. Corp.; [London]: SAGE Publications Ltd (ISSN 1687-8132)
Published
2014
Field
Engineering (Physical Sciences)