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About this Engineering article
On the Mechanical Stresses of Cu Through-Silicon Via (TSV) Samples Fabricated by SK Hynix vs. SEMATECH – Enabling Robust and Reliable 3-D Interconnect/Integrated Circuit (IC) Technology by Tian, Tian; Morusupalli, R.; Shin, H.; Son, H.-Y.; Byun, K.-Y.; Joo, Y.-C.; Caramto, R.; Smith, L.; Shen, Y-L.; Kunz, M.; Tamura, N.; Budiman, A.S. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Tian, Tian; Morusupalli, R.; Shin, H.; Son, H.-Y.; Byun, K.-Y.; Joo, Y.-C.; Caramto, R.; Smith, L.; Shen, Y-L.; Kunz, M.; Tamura, N.; Budiman, A.S.
- Publisher
- Elsevier ; [Oxford]: Elsevier Ltd.; Elsevier BV (ISSN 1877-7058)
- Published
- 2016
- Field
- Engineering (Physical Sciences)