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This study presents a dynamic electro-thermal coupling analysis (ETCA) approach to evaluate the electro-thermal behavior of a three-phase power MOSFET inverter during load cycles. The proposed method integrates electromagnetic simulation, circuit simulation for power loss, and a Foster thermal network model to predict junction temperature, effectively addressing the challenges of computational efficiency and accuracy in modeling. Validation of the ETCA approach demonstrates its capability to characterize th

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factsball007

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EN