About this scholarly article

2013 IEEE 63rd Electronic Components and Technology Conference - Surface compliant bonding properties of low-temperature wafer bonding using sub-micron Au particles by Ishida, Hiroyuki; Ogashiwa, Toshinori; Kanehira, Yukio; Murai, Hiroshi; Yazaki, Takuya; Ito, Shin; Mizuno, Jun is a scholarly article available to read on EtoBox.

Author

Ishida, Hiroyuki; Ogashiwa, Toshinori; Kanehira, Yukio; Murai, Hiroshi; Yazaki, Takuya; Ito, Shin; Mizuno, Jun

Publisher

IEEE

Published

2013

Language

EN