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About this scholarly article
2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - The in-situ measurement of thermal stress on stacked 3D-IC by utilizing synchrotron radiation X-ray by Hsu, Hsueh-Hsien; Chang, Tao-Chih; Chen, Chih; Lee, Hsin-Yi; Wu, Albert T. is a scholarly article available to read on EtoBox.
- Author
- Hsu, Hsueh-Hsien; Chang, Tao-Chih; Chen, Chih; Lee, Hsin-Yi; Wu, Albert T.
- Publisher
- IEEE
- Published
- 2010
- Language
- EN
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