About this scholarly article

2001 IEEE MTT-S International Microwave Sympsoium Digest (Cat. No.01CH37157) - LTCC as MCM substrate: design of strip-line structures and flip-chip interconnects by Schmuckle, F.J.; Jentzsch, A.; Heinrich, W.; Butz, J.; Spinnler, M. is a scholarly article available to read on EtoBox.

Author

Schmuckle, F.J.; Jentzsch, A.; Heinrich, W.; Butz, J.; Spinnler, M.

Publisher

IEEE

Published

2001