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About this Engineering article
Effects of Packaging on RF MEMS Switch’s Return Loss by Yang, Le; Liao, Xiao Ping is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Yang, Le; Liao, Xiao Ping
- Publisher
- Trans Tech Publications, Ltd.; Trans Tech Publications (ISSN 1662-8958)
- Published
- 2009
- Language
- EN
- Field
- Engineering (Physical Sciences)