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Thermal fatigue life of ball grid array (BGA) solder joints made from different alloy compositions by Depiver, Joshua A. (author);Mallik, Sabuj (author);Amalu, Emeka H. (author) is a scholarly article available to read on EtoBox.

What is Thermal fatigue life of ball grid array (BGA) solder joints made from different alloy compositions about?

As temperature cycling drives fatigue failure of solder joints in electronic modules, characterisation of the thermal fatigue response of different solder alloy formulations in BGA solder joints functioning in mission-critical systems has become crucial. Four different lead-free and one eutectic lead-based solder alloys in BGA solder joints are characterised against their thermal fatigue lives (TFLs) to predict their mean-time-to-failure for preventive maintenance advice. Five finite elements (FE) models of the assemblies of the BGAs with the different solder alloy compositions are created with SolidWorks. The models are subjected to standard IEC 60749-25 temperature cycling in ANSYS mechanical package environment. Plastic strain, shear strain, plastic shear strain, and accumulated creep energy density responses of the solder joints are obtained and inputted into established life prediction models -Coffin Manson, Engelmaier, Solomon and Syedto determine the lives of the models. SAC405 joints have the highest predicted TFL of circa 13.2 years, while SAC387 joints have the least life of circa 1.4 years. The predicted lives are inversely proportional to the magnitude of the areas of s

Author

Depiver, Joshua A. (author);Mallik, Sabuj (author);Amalu, Emeka H. (author)

Publisher

Elsevier BV

Published

2021

Language

EN