About this scholarly article

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Novel on-chip Through-Silicon-Via Wilkinson power divider by Woods, Wayne; Ding, Hanyi; Wang, Guoan; Joseph, Alvin is a scholarly article available to read on EtoBox.

Author

Woods, Wayne; Ding, Hanyi; Wang, Guoan; Joseph, Alvin

Publisher

IEEE

Published

2010

Language

EN