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About this Engineering article
Electromigration in Submicron Dual-damascene Cu/low-k Interconnects by Lee, Ki-Don; Lu, Xia; Ogawa, Ennis T.; Matsuhashi, Hideki; Blaschke, Volker A.; Augur, Rod; Ho, Paul S. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Lee, Ki-Don; Lu, Xia; Ogawa, Ennis T.; Matsuhashi, Hideki; Blaschke, Volker A.; Augur, Rod; Ho, Paul S.
- Publisher
- Cambridge University Press; Cambridge University Press (Materials Research Society); Cambridge University Press (CUP) (ISSN 0272-9172)
- Published
- 2002
- Language
- EN
- Field
- Engineering (Physical Sciences)