About this scholarly article

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Study of MEMS self-assembly using molten solder ball by Lei Yang, ; Wang, Chunqing; Wei Liu, ; Yang Li, is a scholarly article available to read on EtoBox.

Author

Lei Yang, ; Wang, Chunqing; Wei Liu, ; Yang Li,

Publisher

IEEE

Published

2010