About this scholarly article

2008 2nd Electronics Systemintegration Technology Conference - Electrical property of conductive adhesives using silver-coated copper filler by Nishikawa, H.; Mikami, S.; Terada, N.; Miyake, K.; Aoki, A.; Takemoto, T. is a scholarly article available to read on EtoBox.

Author

Nishikawa, H.; Mikami, S.; Terada, N.; Miyake, K.; Aoki, A.; Takemoto, T.

Publisher

IEEE

Published

2008

Language

EN