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SPIE Proceedings [SPIE SPIE OPTO - San Francisco, California, United States (Saturday 7 February 2015)] MOEMS and Miniaturized Systems XIV - Multi-wafer bonding technology for the integration of a micromachined Mirau interferometer by Piyawattanametha, Wibool; Park, Yong-Hwa; Wang, Wei-Shan; Lullin, Justine; Froemel, Joerg; Wiemer, Maik; Bargiel, Sylwester; Passilly, Nicolas; Gorecki, Christophe; Gessner, Thomas is a scholarly article available to read on EtoBox.

Author
Piyawattanametha, Wibool; Park, Yong-Hwa; Wang, Wei-Shan; Lullin, Justine; Froemel, Joerg; Wiemer, Maik; Bargiel, Sylwester; Passilly, Nicolas; Gorecki, Christophe; Gessner, Thomas
Publisher
SPIE
Published
2015
Language
EN