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About this scholarly article
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Heat transfer analysis of vapor chamber heat pipe for high power LED package by Zhi You, ; Yang, D.; Peng Zhou, ; Yang Hai, ; Dongjing Liu, ; Fengze Hou, is a scholarly article available to read on EtoBox.
- Author
- Zhi You, ; Yang, D.; Peng Zhou, ; Yang Hai, ; Dongjing Liu, ; Fengze Hou,
- Publisher
- IEEE
- Published
- 2010
- Language
- EN
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