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About this Engineering article
Properties and Reliability of Solder Microbump Joints Between Si Chips and a Flexible Substrate by Ko, Yong-Ho; Kim, Min-Su; Bang, Junghwan; Kim, Taek-Soo; Lee, Chang-Woo is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Ko, Yong-Ho; Kim, Min-Su; Bang, Junghwan; Kim, Taek-Soo; Lee, Chang-Woo
- Publisher
- Kessinger Publishing, Llc
- Published
- 2015
- Language
- EN
- ISBN
- 9781166401535
- Field
- Engineering (Physical Sciences)
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