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About this Engineering article
Rearch of Data Interpolation in Airlevel Posture Sensor by Li, Bai Hua; Piao, Lin Hua; Ji, Ming Ming is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Li, Bai Hua; Piao, Lin Hua; Ji, Ming Ming
- Publisher
- Trans Tech Publications, Ltd.; Trans Tech Publications (ISSN 1662-8958)
- Published
- 2011
- Field
- Engineering (Physical Sciences)
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