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3D IC Integration and Packaging (Electronics) by John H. Lau is a nonfiction available to read on EtoBox.

What is 3D IC Integration and Packaging (Electronics) about?

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product . A comprehensive guide to 3D IC integration and packaging technology 3D IC Integration and Packaging fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption. Based on a course developed by its author, this practical guide offers real-world problem-solving methods and teaches the trade-offs inherent in making system-level decisions. Explore key enabling technologies such as TSV, thin-wafer strength measurement and handling, microsolder bumping, redistribution layers, interposers, wafer-to-wafer bonding, chip-to-wafer bonding, 3D IC and MEMS, LED, and complementary metal-oxide semiconductor image sensors integration. Assembly, thermal management, and reliability are covered in complete detail. 3D IC Integration and Packaging covers: • 3D integration for semiconductor IC packaging • Through-silicon vias modeling and testing • Stress sensors for thin-wafer handling and strength measurement • Package substrate

Who reads 3D IC Integration and Packaging (Electronics)?

Author

John H. Lau

Publisher

McGraw Hill Education

Published

2015

Language

EN

ISBN

9780071848077

Category

nonfiction

Subjects

Engineering, Stem