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About this Engineering article
Estimation of Thermal Parameters of the Enclosed Electronic Package System by Using Dynamic Thermal Response by Jung-Kyun Kim; Wataru Nakayama; Yoshimi Ito; Sang-mo Shin; Sun-Kyu Lee is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Jung-Kyun Kim; Wataru Nakayama; Yoshimi Ito; Sang-mo Shin; Sun-Kyu Lee
- Publisher
- Elsevier Science; Elsevier ; Elsevier Ltd.; Elsevier BV (ISSN 0957-4158)
- Published
- 2009
- Language
- EN
- Field
- Engineering (Physical Sciences)
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