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Electrochemical Fabrication of Buried Folded Microchannels Into Silicon Substrates by G. Barillaro; A. Nannini; M. Piotto is a Materials Science article available to read on EtoBox.
What is Electrochemical Fabrication of Buried Folded Microchannels Into Silicon Substrates about?
## Abstract In this work an original process for buried folded silicon microchannel fabrication is reported. Electrochemical micromachining is exploited to etch high aspect ratio meander‐shaped trenches into a silicon substrate. Thermal oxidation is then employed to seal the top of etched trenches and obtain buried microchannels at the bottom. The process is straightforward and allows the integration of buried folded channels into silicon substrates with a high density. Experimental results are reported and advantages and drawbacks of the proposed process are discussed. (© 2007 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)
Who reads Electrochemical Fabrication of Buried Folded Microchannels Into Silicon Substrates?
It is typically read by researchers, students, and practitioners in Materials Science.
- Author
- G. Barillaro; A. Nannini; M. Piotto
- Publisher
- John Wiley and Sons; Wiley (John Wiley & Sons); John Wiley & Sons Ltd.; Wiley; Wiley - V C H Verlag GmbbH & Co. (ISSN 0031-8965)
- Published
- 2007
- Language
- EN
- Field
- Materials Science (Physical Sciences)