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About this Engineering article
Wafer-level packaging based on uniquely orienting self-assembly (the DUO-SPASS processes) by Fang, J.; Bohringer, K.F. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Fang, J.; Bohringer, K.F.
- Publisher
- IEEE; Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 1057-7157)
- Published
- 2006
- Field
- Engineering (Physical Sciences)